Qualcomm Snapdragon C1-10-100 socket: Qualcomm BGA 1287

The Qualcomm Snapdragon C1-10-100 uses Qualcomm BGA 1287, soldered with 1,287 balls. It is an 8-core Snapdragon C laptop part running to 3.0 GHz at 7 W, and the soldered chip cannot be replaced or upgraded.

Launched
August 2026
Cores and threads
8 and 8
Base power
7 W
Codename
Kryo 670
Segment
Mobile (soldered)
Clocks
2.0 / 3.0 GHz

Qualcomm Snapdragon C1-10-100 specifications

Cores8 (Kryo 670, efficiency tuned clusters)
Threads8 (one thread per core)
Core architectureQualcomm Kryo 670, ARM64 compatible
ClocksSingle core to 3.0 GHz; all cores to 2.0 GHz (1 core 3.0, 3 cores 2.6, 4 cores 2.0 GHz)
Cache2 MB total
Processor base power (TDP)7 W
Manufacturing process6 nm
Memory supportLPDDR5/5x to 6400 MT/s or LPDDR4x to 4200 MT/s, to 16 GB
PCI Express3 lanes Gen 3
Integrated graphicsAdreno A643 to 900 MHz
NPUHexagon NPU (no TOPS figure published)
PackageSoldered BGA with 1,287 balls (BGA 1287)

Motherboard compatibility

Qualcomm Snapdragon C1-10-100 needs a motherboard with a Qualcomm BGA 1287 socket. Chipset by chipset data for this codename is not recorded yet. See the Qualcomm BGA 1287 chipset list and the board maker's CPU support list.

Qualcomm BGA 1287 at a glance

TypeBGA, 1,287 contacts
Package sizen/a
IntroducedAugust 2026
MemoryLPDDR5/5x up to 6400 MT/s or LPDDR4x up to 4200 MT/s, to 16 GB
Cooler mounting holesNot applicable (soldered)

Read the full Qualcomm BGA 1287 socket guide

What the Snapdragon C1-10-100 is

The Snapdragon C1-10-100 is the launch processor of the Snapdragon C platform, detailed by Qualcomm in August 2026 for laptops starting near 300 dollars. It carries eight Kryo 670 cores with eight threads, one per core, arranged for efficiency rather than peak speed: one core reaches 3.0 GHz, three cores reach 2.6 GHz and the remaining four top out at 2.0 GHz, with 2.0 GHz as the sustained all-core maximum. Total cache is 2 MB. The 7 W rating and 6 nm fabrication aim squarely at quiet fan-light school and office laptops with all-day battery life.

Graphics come from the Adreno A643 at up to 900 MHz with DirectX 12 support, enough for desktop work, video playback and classroom applications on Full HD Plus panels to 120 Hz. A dedicated Hexagon NPU adds modern AI capabilities for everyday laptop tasks, though Qualcomm publishes no TOPS figure for it. Platform I/O includes Wi-Fi 6 and 6E through FastConnect, USB-C and USB-A ports, and PCIe 3.0 NVMe alongside UFS storage.

Qualcomm positions Snapdragon C against entry Intel N series processors, citing up to 67 percent faster Cinebench multi-core scores on battery versus the Intel N250 in its own testing. Independent reviews of shipping Acer and similar designs will show where AC-powered performance lands, since Qualcomm published battery figures first. For browsing, documents, streaming and schoolwork at a low price, the C1-10-100 covers the brief while sipping power.

Socket and motherboard compatibility

The C1-10-100 fits Qualcomm BGA 1287 and stays soldered for life. The 1,287-ball package joins the board at the factory with no socket hardware, so no field exchange is possible. Laptop vendors build complete sealed boards around it with soldered memory, leaving buyers to compare finished budget laptops. The LGA, PGA and BGA: CPU package types explained guide explains how this sealed style differs from socketed desktop systems.

Chipset selection as desktop buyers understand it does not occur on this platform. Compute, graphics, AI acceleration, memory control and I/O share the SoC, so ports, display limits and wireless follow the vendor design. External display support tops out at one 4K screen at 60 Hz over DisplayPort 1.4, and onboard panels reach Full HD Plus at 120 Hz. Check the exact laptop sheet for RAM size, storage type and port mix before ordering.

Service manuals for budget machines deserve a read before purchase. Some designs allow SSD access while processor and memory remain sealed. Knowing which covers open helps plan repairs and later storage changes within the limits of a sealed low-cost laptop.

Memory, PCIe and cooling

Memory support reaches 16 GB of LPDDR5 or LPDDR5x to 6400 MT/s, or LPDDR4x to 4200 MT/s on cost-focused boards. That ceiling suits classroom and office work with modest multitasking, though heavy users who keep dozens of browser tabs beside large documents should treat 16 GB as a firm limit. Soldered memory on typical boards makes the factory size permanent.

Storage and expansion run over 3 lanes of PCI Express 3.0 for NVMe plus UFS 2.2 and 3.1 support, modest links that match the entry brief. USB reaches 3.1 with up to two USB-C and two USB-A ports on reference designs. Wireless covers Wi-Fi 6 and 6E with Bluetooth accessories, which keeps school and office connectivity current.

Cooling follows the thin low-power chassis with no mounting pattern and no boxed cooler, and the 7 W class often allows quiet fan-light operation. Buyers should still read vendor battery and noise claims for the exact model, since chassis size and screen brightness shape real battery life more than the chip alone. A larger battery and an efficient panel matter as much as silicon efficiency at this price.

Upgrade paths

No processor upgrade exists on Qualcomm BGA 1287. The soldered C1-10-100 cannot be removed, and weaker or stronger C variants would each need their own boards. When school or office demands outgrow the machine, the remedy is a replacement laptop with files moved across. Low prices make that step affordable, but backups still protect schoolwork and documents.

Purchase comparisons should weigh RAM size, storage, display quality, keyboard and battery rather than future chip options. Since memory tops out at 16 GB across the platform, choosing the larger factory memory option pays off over the years. The LGA, PGA and BGA: CPU package types explained guide gives background on sealed laptop tradeoffs.

For a long service life, pick the 16 GB configuration where offered, confirm SSD access for later drive swaps, and keep the system updated through vendor channels. A well-chosen budget laptop serves through several school years even though its processor never changes.

Frequently asked questions

What socket does the Snapdragon C1-10-100 use?

Qualcomm BGA 1287, a soldered ball grid array with 1,287 contacts. The processor is fixed to the board permanently.

What are the core counts and clock speeds of the C1-10-100?

Eight Kryo cores with a 3.0 GHz single-core maximum and a 2.0 GHz multi-core maximum, arranged as one core to 3.0 GHz, three cores to 2.6 GHz and four cores to 2.0 GHz. Total cache is 2 MB.

What memory does the C1-10-100 support?

Up to 16 GB of LPDDR5 or LPDDR5x to 6400 MT/s, or LPDDR4x to 4200 MT/s. Memory is soldered on typical boards.

Can the C1-10-100 be upgraded later?

No. The BGA chip is soldered, so a faster processor means buying a different laptop. Compare complete budget systems instead.

Sources and verification

  1. Snapdragon C Platform Product Brief (Qualcomm)
  2. Qualcomm details Snapdragon C specs for $300 laptops (Tom's Hardware)
  3. Technical details on and further notebooks with Snapdragon C (heise online)

Facts last checked against these sources on . Page last edited on .