AMD FX-7500 socket: Socket FP3

The AMD FX-7500 uses the Socket FP3 socket as a soldered BGA chip and cannot be replaced. It is a quad Kaveri ULV APU from 2.1 GHz to 3.3 GHz at 19 W with Radeon R7 graphics.

Launched
June 2014
Cores and threads
4 and 4
Default TDP
19 W
Codename
Kaveri
Segment
Mobile (soldered)
Family
AMD FX
Clocks
2.1 / 3.3 GHz

AMD FX-7500 specifications

Cores4
Threads4
Core architectureSteamroller (Kaveri) cores on 28 nm
Clocks2.1 GHz base, up to 3.3 GHz turbo
Cache4 MB L2 (no L3)
Processor base power (TDP)19 W
Manufacturing process28 nm SHP
Memory supportDDR3-1600, one or two channels
PCI ExpressPCIe 2.0 board I/O (graphics link on package)
Integrated graphicsAMD Radeon R7 (384 shaders, 496 MHz to 553 MHz)
MultiplierLocked
PackageSocket FP3 (uBGA906, soldered)

Motherboard compatibility

AMD FX-7500 needs a motherboard with a Socket FP3 socket. Chipset by chipset data for this codename is not recorded yet. See the Socket FP3 chipset list and the board maker's CPU support list.

Socket FP3 at a glance

TypeBGA, 906 contacts
Package sizen/a
IntroducedJune 2014
MemoryDDR3-2133 and 1600, one or two channels, ECC on selected designs
Cooler mounting holesNot applicable (soldered)

Read the full Socket FP3 socket guide

What the FX-7500 is

The FX-7500 is a ULV Kaveri quad on Socket FP3 for thin notebooks with real graphics. It runs 4 Steamroller cores and 4 threads at 2.1 GHz base with turbo to 3.3 GHz. Four megabytes of L2 cache cover multitasking. Power is 19 W on 28 nm from June 2014.

The 19 W envelope with four threads suits ultrabooks that still need R7 graphics. Radeon R7 with 384 shaders from 496 MHz to 553 MHz plays older titles at 720p. Turbo covers bursts while efficiency holds battery. The soldered package means the notebook choice locks everything.

DDR3-1600 over one or two channels feeds cores and graphics. The FX-7500 covers 2014 thin notebooks where ULV quad threads with R7 must fit 19 W.

Socket and motherboard compatibility

The FX-7500 solders to the board on Socket FP3 and cannot be replaced. Thin bodies often solder memory beside the chip. Boards wire eDP panels with small batteries.

FP3 ULV designs use SoC I/O throughout. The LGA, PGA and BGA: CPU package types explained guide explains soldered thin limits.

Memory, PCIe and cooling

DDR3-1600 over one or two channels suits thin notebooks. Dual channel pairs help R7 video. Low voltage SODIMMs stretch battery.

PCIe 2.0 board lanes serve SSDs and radios. Thin SSDs match the power budget. Most builds rely on R7 graphics.

Cooling is passive leaning with small fans for 19 W. Turbo trims under sustained load. Thin bodies throttle first.

Upgrade paths

On the same socket, the AMD FX-7600P at 2.7 GHz to 3.6 GHz with 35 W tuning above adds speed, while Beema ULV parts cover cheaper thin duty. All share FP3 boards where listed.

Carrizo ULV parts cover newer thin notebooks. The FX-7500 holds ULV R7 Kaveri duty at 19 W.

Frequently asked questions

What socket does the AMD FX-7500 use?

It uses Socket FP3 as a soldered chip.

How many cores does the FX-7500 have?

Four cores and four threads at 2.1 GHz base with turbo to 3.3 GHz.

Which graphics does the FX-7500 include?

AMD Radeon R7 with 384 shaders from 496 MHz to 553 MHz.

What is the TDP of the FX-7500?

19 W ULV tuning.

Sources and verification

  1. AMD Kaveri FX-7500 Notebook Processor (Notebookcheck)
  2. Analysis of the AMD Kaveri Notebook Platform (Notebookcheck, family data)

Facts last checked against these sources on . Page last edited on .