AMD EPYC 7573X socket: SP3

What the EPYC 7573X is

Buyers meet the EPYC 7573X as the 32-core member of the Milan-X family for SP3 boards from March 2022. 32 cores with simultaneous multithreading give 32 cores and 64 threads, with base at 2.8 GHz and up to 3.6 GHz boost. The package carries 768 MB of L3 with 512 MB stacked as 3D V-Cache on top of 256 MB planar cache. The 280 W envelope fits standard server heatsinks with front to back airflow.

DDR4-3200, 8 channels, up to 4 TB with ECC feed the cores, and matched RDIMMs hold the rated speed. One hundred twenty eight Gen4 lanes per socket wire NICs, accelerators and NVMe. Boards run one or two sockets with the same memory and IO per CPU.

Balanced technical computing takes this 32-core Milan-X part with 768 MB of stacked L3, where the cache flattens memory bound scaling. Boards need an SP3 platform with the EPYC 7573X on the support list. The Socket vs chipset: what decides whether a CPU works guide covers server board choice, and AMD EPYC 7373X shows a nearby option on the same socket.

Socket and motherboard compatibility

The 7573X fits SP3 on single and dual socket server boards with LGA 4094 retention and server power delivery. Board lists must name the EPYC 7573X part for qualification.

Platform choice decides management and IO breadth rather than CPU fit. Boards carry BMC management, multiple NICs and NVMe backplanes for this power class. A BIOS that lists Milan-X from March 2022 covers the part, while early firmware may need an update for specific stepping IDs. Check the board list before mixing this SKU with other steppings.

Memory, PCIe and cooling

DDR4-3200, 8 channels, up to 4 TB with ECC feed the cores, and matched RDIMMs hold the rated speed. Population with matched DIMMs holds the rated speed, and eight channel operation needs one DIMM per channel at minimum for full bandwidth. Capacity reaches 4 TB per socket with high density DIMMs.

One hundred twenty eight Gen4 lanes per socket wire NICs, accelerators and NVMe. Lane bifurcation follows board firmware, so slot population rules come from the board manual.

The 280 W envelope needs a server heatsink with front to back airflow and a chassis with redundant fans. The large package uses a carrier with even mounting pressure. Paste and torque sequence follow the heatsink maker specification.

Upgrade paths

On SP3 the upward moves are higher core Milan-X parts where VM counts grow, or adding a second EPYC 7573X socket where boards allow two socket operation. For this 32-core SKU, memory growth to full channel population and NIC additions often help more than clocks.

Outside this SKU, AMD EPYC 7373X (EPYC 7373X) on SP3 trims or adds cores for lighter or denser loads. Standard Milan parts trade stacked cache for clocks at the same core counts, while Genoa parts move the platform to SP5 with DDR5. A move to another socket needs a new board and memory plan, so socket local growth comes first.