AMD EPYC 73F3 socket: SP3

The AMD EPYC 73F3 uses SP3, the LGA socket for EPYC server processors with DDR4 ECC memory. The 16-core chip at 240 W needs a server board, and runs single or dual socket.

Socket
SP3
Launched
March 15, 2021
Cores and threads
16 and 32
Default TDP
240 W
Codename
Milan
Segment
Server
Family
AMD EPYC
Clocks
3.5 / 4.0 GHz

AMD EPYC 73F3 specifications

Cores16
Threads32
Core architectureZen 3 (Milan)
Clocks3.5 GHz base, up to 4 GHz boost
Cache8 MB L2 plus 256 MB L3
Default TDP240 W
Manufacturing processTSMC 7 nm FinFET
Memory supportDDR4-3200 ECC, 8 channels, up to 4 TB per socket
PCI Express128 PCIe Gen4 lanes per socket, up to 160 in 2P
Integrated graphicsNone (BMC graphics on board)
MultiplierLocked
ECC memorySupported, DDR4 ECC RDIMM
PackageSP3 LGA4094
Cooler in the boxNone, server heatsink required

Motherboard compatibility

AMD EPYC 73F3 needs a motherboard with a SP3 socket. Chipset by chipset data for this codename is not recorded yet. See the SP3 chipset list and the board maker's CPU support list.

SP3 at a glance

TypeLGA, 4,094 contacts
Package size58.5 × 75.4 mm
IntroducedJune 2017
MemoryDDR4 ECC RDIMM, 8 channels to DDR4-3200, up to 4 TB per socket
Cooler mounting holesBoard specific (server heatsink)

Read the full SP3 socket guide

What the EPYC 73F3 is

AMD EPYC 73F3, launched in March 2021 for SP3, brings 16 cores and 32 threads to frequency-optimised servers. Milan cores run 3.5 GHz base with up to 4 GHz boost, backed by 256 MB of L3 plus 8 MB of L2. The 240 W rating sets server cooling and power delivery.

Memory support covers DDR4-3200 ECC, 8 channels, up to 4 TB per socket. Eight channels feed virtual machines and databases, and ECC corrects single-bit errors during continuous duty. Gen4 lanes serve NVMe, NICs and accelerators, 128 per socket and 160 across two.

Frequency-optimised F parts trade cores for clocks, keeping the full 256 MB of L3 behind only 16 cores. Licensed databases and single-thread peaks benefit most from 4 GHz boost. A nearby option on the same socket is AMD EPYC 72F3, which steps cores and TDP.

Socket and motherboard compatibility

The EPYC 73F3 fits SP3 on single or dual socket server boards with LGA retention and server power delivery. Board lists must name the exact SKU for qualification.

Memory population, lane splits and cooling follow the server board design. Two-socket boards share the 160-lane budget across both processors. The Socket vs chipset: what decides whether a CPU works guide shows how platform choice maps to generations.

Memory, PCIe and cooling

DDR4-3200 ECC, 8 channels, up to 4 TB per socket. Matched RDIMMs hold the rated speed across all populated channels.

128 PCIe Gen4 lanes per socket, up to 160 in 2P wire NVMe, NICs and accelerators. Lane budgets decide how many devices run at full speed.

Cooling belongs to the server maker across the 240 W band with front-to-back airflow. No boxed cooler exists. Paste service follows the maker manual.

Where this Milan part fits

The Milan stack spans 8 to 64 cores, and this 16-core SKU sits where core licensing, power caps or per-core fees shape the order. Fewer, faster cores beat more, slower cores for licensed databases, while dense virtualisation takes higher counts. The 256 MB L3 keeps working sets close on both shapes.

Single-socket boards cut idle draw for edge racks while dual-socket boards serve dense virtualisation. Populate all eight memory channels for full bandwidth on either shape, since empty channels cost throughput on memory-bound work. The EPYC 73F3 needs a board that lists it by name with the right firmware.

Boards need firmware with Milan support before the chip posts, so buyers confirm the BIOS revision with the vendor. Memory population order follows the board manual with primary slots first, and all eight channels should fill for full bandwidth on memory-bound work.

Inside the Milan stack this SKU pairs 16 cores with 256 MB L3 of L3, about 16 MB per core, set against 16 cores against 8 cores with matching 256 MB of cache in [[cpu:EPYC 72F3]]. Base power of 240 W puts it in the family band that spans 95 W to 280 W, which decides heatsink size and rack power budgets.

Upgrade paths

On SP3 the moves run along core count within the same board class, up to flagships such as AMD EPYC 72F3 where validated. Core growth needs no board change when the maker lists the part.

Beyond the series the replacement is a whole server on newer platforms. The LGA, PGA and BGA: CPU package types explained guide explains when a platform change pays off.

Frequently asked questions

What socket does the AMD EPYC 73F3 use?

It uses SP3 on single or dual socket server boards.

How many cores does the AMD EPYC 73F3 have?

16 cores with 32 threads at 3.5 GHz base and up to 4 GHz boost, with 256 MB of L3.

What memory does the AMD EPYC 73F3 support?

DDR4-3200 ECC, 8 channels, up to 4 TB per socket.

Does the AMD EPYC 73F3 have integrated graphics?

No. Boards provide BMC graphics for management.

What is the TDP of the AMD EPYC 73F3?

240 W with server cooling required.

How many PCIe lanes does the AMD EPYC 73F3 offer?

128 PCIe Gen4 lanes per socket, up to 160 in 2P for NVMe, NICs and accelerators.

Which boards fit this processor?

Single or dual socket SP3 server boards that list the exact SKU with matching firmware.

When did the AMD EPYC 73F3 launch?

March 2021 with the Milan stack.

What process does the AMD EPYC 73F3 use?

TSMC 7 nm FinFET, shared across the Milan stack.

Sources and verification

  1. AMD AMD EPYC 73F3 (AMD)
  2. AMD AMD EPYC 73F3 specs (TechPowerUp)

Facts last checked against these sources on . Page last edited on .