AMD Athlon XP-M 2200+ socket: Socket 563

What the Athlon XP-M 2200+ is

The AMD Athlon XP-M 2200+ is a 1667 MHz low power mobile processor from July 2004. It runs one K7 Barton core at 1667 MHz with no turbo, so 1 core gives 1 thread. Cache is 512 KB of L2 with 64 KB of L1 instruction and 64 KB of L1 data cache on a 130 nm process. Power is rated at 27 W in a 563-pin microPGA package for thin notebooks.

Low power marks the difference from Socket 462 mobiles. Standard power XP-M Barton parts use Socket 462 packages at 55 W and 72 W with similar clocks, while the 2200+ at 1667 MHz uses the smaller Socket 563 package at 1.30 V to 1.35 V for 27 W operation. The part runs a 266 MT/s front side bus with PowerNow trimming voltage and clocks on battery. AMD aimed the bin at thin and light notebooks where fan noise and battery life matter more than peak throughput.

Barton cache helps the low clocks. The 512 KB L2 doubles Thoroughbred low power cache, so the 2200+ keeps responsiveness in office tasks despite its modest 1667 MHz frequency. That balance is why Barton low power parts carried higher model numbers than Thoroughbred low power parts at nearby megahertz.

Socket and motherboard compatibility

The XP-M 2200+ fits Socket 563 notebooks with DDR memory and a BIOS that lists 563-pin Barton low power parts. It needs a microPGA board with 563 lands and low voltage delivery, not a Socket 462 board with 462 lands or a Socket 754 K8 board. The Socket vs chipset: what decides whether a CPU works guide covers pairing rules.

Notebook maker lists are narrow here. Only a small set of thin notebooks and a few desktop boards such as the PCChips M863G Ver3 and the ECS K7SOM used Socket 563, often sold bundled with the processor and heatsink. A Socket 462 chip does not seat in the 563-pin socket, even when the model number looks close. Forcing packages across sockets can damage lands and pins.

Memory, PCIe and cooling

Memory is DDR through the board chipset in a single channel. Notebook boards fix the SO-DIMM count and ceiling, with speed tied to the 266 MT/s bus. The CPU has no memory controller, so the mobile chipset sets timing.

No PCIe lanes come from the die. The front side bus ties the CPU to the mobile chipset, while AGP serves graphics and PCI serves other devices. Cooling is the notebook heat pipe assembly for the exact thin chassis, sized for 27 W with fan control tied to CPU temperature. PowerNow drops clocks and voltage at idle, which keeps fan noise low in small enclosures. A move to DDR2 needs Socket S1 with a new board.

Upgrade paths

On Socket 563 the path includes higher Barton XP-M parts to 2800+ in 563-pin packages when the notebook maker lists them. Standard power Socket 462 notebooks with XP-M 2800+ parts at 2.133 GHz offer higher clocks in larger chassis with bigger cooling. Desktop Socket 462 towers with Barton 2500+ parts at 1833 MHz offer similar cache with wall power and tower heatsinks. Beyond these K7 mobiles a move to Socket S1 needs a new notebook for Turion parts with DDR2 memory. The 2200+ lifts with the socket mechanism, so qualified swaps need no solder work.